| Date |
Society name |
Content |
Author(s) |
| September 6, 2013 |
Technical Committee on Integrated Circuits and Devices (ICD) |
“～The computer which surpasses a brain is aimed at ～
Hinomaru venture to challenge the world by Multi-ManyCore & 3D-stacked LSI” |
Yukoh Matsumoto |
| July 19, 2013 |
MPSoC'13 |
“SMYLEvideo distributed stream processing heterogeneous
Manycore architecture for Video Mining Applications” |
Yukoh Matsumoto |
| April 11, 2013 |
ICEP2013 |
“Cool System - An Energy-Efficient and Scalable 3D Heterogeneous
Multi-Chip System Consists of Cool Interconnect, Cool Chip, and Cool Software” |
Yukoh Matsumoto |
| January 30, 2013 |
The 2nd Manycore symposium
panel discussion |
“What does many-core bring about?
～From basic research to business development.” |
Sunao Torii |
| January 25, 2013 |
18th Asia and South Pacific Design Automation Conference
(ASP-DAC 2013) |
“Manycore Processor for Video Mining Applications” |
Yukoh Matsumoto |
| November 8, 2012 |
Workshop on Domain-Specific Multicore Computing
(DSMC) 2012 |
“TOPSTREAM : A scalable Heterogeneous Multicore Platform” |
Yukoh Matsumoto |
| October 23, 2012 |
Japan Society for the Promotion of Science (JSPS) |
“Research and Development results of a heterogeneous Multi-Chip
stacked COOL System and, Standardization of the interconnect between stacked chips” |
Yukoh Matsumoto |
| September 20 - 22, 2012 |
MCSoC-12 |
“Cool System: A Scalable and Energy-Efficient 3D
Heterogeneous Multi-Chip System with Cool Interconnect, Cool Chip, and Cool Software” |
Yukoh Matsumoto |
| August 29, 2012 |
U-Homes-2012 |
“Smart Home to be Enabled by Next Generation Scalable Heterogeneous Multi-Core
/ Many-Core and 3D LSI stacking” |
Yukoh Matsumoto |
| July 12, 2012 |
MPSoC'12 |
“Distributed Processing Heterogeneous Multicore / Manycore / 3D Multichip SoC
with Zero-Overhead Message Passing and Stream Processing HW/SW mechanism” |
Yukoh Matsumoto |
| April 20, 2012 |
COOL Chips XV |
“Cool System Scalable 3-D stacked Heterogeneous Multi-Core / Multi-Chip Architecture for Ultra Low-Power Digital TV Applications” |
Yukoh Matsumoto |
| March 30, 2012 |
The 1st Manycore symposium |
“Development of many-core for video mining” |
Yukoh Matsumoto |
| March 9, 2012 |
Japan Institute of Electronics Packaging (JIEP) |
“Preparation of Au Bump to the cone shape on the LSI chip /
Flip-chip bonding” |
FumitoImura,Syunsuke Nemoto,
Naoya Watanabe,Fumiki Kato,Katsuya Kikuchi,Hiroshi Nakagawa,
Masahiro Aoyagi(AIST)
Tomoyuki Morimoto,Michiya Hagimoto,
Hiroyuki Uchida,Nobuyuki Hikichi,
Yukoh Matsumoto(TOPS Systems) |
| March 6, 2012 |
Technical Committee on VLSI Design Technologies (VLD) |
“LSI Implementation of Heterogeneous Multi-Chip Processor for energy-saving Embedded Systems : COOL Chip” |
Hiroyuki Uchida,Michiya Hagimoto,
Tomoyuki Morimoto,Nobuyuki Hikichi,
Yukoh Matsumoto(TOPS Systems)
Fumito Imura,Naoya Watanabe,
Katsuya Kikuchi,Motohiro Suzuki,
Hiroshi Nakagawa,Masahiro Aoyagi(AIST) |
| October 25, 2011 |
System LSI Design Methodology (IPSJ-SLDM) |
“Heterogeneous Many-Core Application Processor Architecture for Ultra-High-Quality Image
Reproduction” |
Yukoh Matsumoto |
| September 1, 2011 |
Technical Committee on Integrated Circuits and Devices (ICD) |
Heterogeneous Many-Core Application Processor Architecture for Ultra-High-Quality Image
Reproduction |
Yukoh Matsumoto |
| July 5, 2011 |
MPSoC 2011 |
“COOL System: Low-Power 3-D Heterogeneous Multi-Core/Multi-Chip Architecture” |
Yukoh Matsumoto |
| April 21, 2011 |
COOL Chips XIV |
“COOL Interconnect Low Power Interconnection Technology
for Scalable 3D LSI Design” |
Marco Chacin,Hiroyuki Uchida,
Michiya Hagimoto,Takashi Miyazaki,
Takeshi Ohkawa,Rimon Ikeno,
Yukoh Matsumoto(TOPS Systems),
Fumito Imura,Motohiro Suzuki,
Katsuya Kikuchi,Hiroshi Nakagawa,
Masahiro Aoyagi(AIST)
|
| April 15, 2011 |
ICEP2011 |
“Flip-chip Interconnection by Nanoparticle Deposited Cone-bumps
for Heterogeneous Multi-chip-stacking COOL Systems” |
Fumito Imura,Shunsuke Nemoto,
Fumiki Kato,Katsuya Kikuchi,
Motohiro Suzuki,Hiroshi Nakagawa,
Masahiro Aoyagi(AIST)
Hiroyuki Uchida,Michiya Hagimoto,
Marco Chacin,Takashi Miyazaki,
Takeshi Ohkawa,Rimon Ikeno,
Yukoh Matsumoto(TOPS Systems) |
| March 4, 2011 |
Technical Committee on VLSI Design Technologies (VLD) |
“A scalable prototyping system for 3D-stacked LSI development” |
Marco Chacin,Hiroyuki Uchida,
Michiya Hagimoto,Takashi Miyazaki,
Takeshi Ohkawa,Rimon Ikeno,
Yukoh Matsumoto(TOPS Systems),
Fumito Imura,Motohiro Suzuki,
Katsuya Kikuchi,Hiroshi Nakagawa,
Masahiro Aoyagi(AIST)
|
| December 6, 2010 |
Embedded Systems (IPSJ-EMB) |
“Development of a Heterogeneous Multi-Chip Stacked COOL System
for energy-saving Embedded Systems” |
Marco Chacin,Hiroyuki Uchida,
Michiya Hagimoto,Takashi Miyazaki,
Takeshi Ohkawa,Rimon Ikeno,
Yukoh Matsumoto(TOPS Systems),
Fumito Imura,Motohiro Suzuki,
Katsuya Kikuchi,Hiroshi Nakagawa,
Masahiro Aoyagi(AIST)
|
| June 30, 2010 |
MPSoC 2010 |
“CG Application Domain Specific Heterogeneous Multi-Core Processor” |
Yukoh Matsumoto |
| September 21, 2009 |
IEEE Portable 2009 | “Basic Power Reduction Technology by Hardware/Software” |
Yukoh Matsumoto, Tadao Nakamura |
| April 16, 2009 |
COOL Chips XII | "Ultra Android: High Energy Efficiency Parallel Java Objects Processing via Object Request Broker on Heterogeneous Multi-core Processor" |
Takeshi Ohkawa,
Yukoh Matsumoto, and Kenji Toda(AIST) |
| April 16, 2009 |
COOL Chips XII |
“CG Application Domain Specific Heterogeneous Multi-Core Architecture and Software corresponds to 800TFLOPS of processing”, |
Yukoh Matsumoto, Yoshinori Ogata(TOYOTA Motor), Motohisa Tominaga(NIHON UNISYS) |
| April 18, 2008 |
COOL Chips XI
panel discussion |
“Multi-Core and Many-Core: Next Steps"” |
Yukoh Matsumoto |
| April 20, 2007 |
COOL Chips X |
“Scalable Multi-Core SoC Platform for Low-Powered Architecture” |
Yukoh Matsumoto,Tadao Nakamura |
| December 15, 2006 |
Technical Committee on Integrated Circuits and Devices (ICD), pp149-154 | “Architecting of TOPSTREAM™ MPEG-4 Heterogeneous Multi-Core for Video Codec” |
Yukoh Matsumoto |
| December 15, 2006 |
Technical Committee on Integrated Circuits and Devices (ICD), pp155-160 | “Architecting of TOPSTREAM™ WLAN Heterogeneous Multi-Core for Wireless LAN” |
Yukoh Matsumoto |
| May 12, 2006 |
Information processing society of Japan Kansai Branch
S-06(Invited Talk) | “TOPSTREAM™ Architecture” |
Yukoh Matsumoto |
| June 21, 2001 |
DAC 38th |
“TS-SLD:The System Level Design Environment tool” |
Yukoh Matsumoto |
| June 13, 2001 |
Embedded Processor Forum |
“Multiple Instruction Stream Computer provides ASIC replacement” |
Yukoh Matsumoto |
